High Density Board (2+N+2)
Suitable for BGA with smaller ball pitch and higher I/O count, increase wiring density in complex design, lower Dk/Df material for better signal transmission performance.
Applications: Mobile phones, PDAs, UMPCs, portable game consoles, digital cameras, camcorders.
Name: | 6-layer 2-stage HDI WiFi module PCB |
Number of layers: | 6 layers |
Material: | FR4 Tg170 |
Structure: | 2+2+2 HDI PCB |
Finished product thickness: | 0. 8mm |
Copper thickness: | 1OZ |
Color: | black/white |
Surface treatment: | immersion gold + OSP |
Minimum trace/space: | 3 million/3 million |
Minimum hole: | laser hole 0. 1mm |
Application: | WiFi module PCB |