High Density Board (2+N+2)
Suitable for BGA with smaller ball pitch and higher I/O count, increase wiring density in complex design, lower Dk/Df material for better signal transmission performance.
Applications: Mobile phones, PDAs, UMPCs, portable game consoles, digital cameras, camcorders.
| Name: | 6-layer 2-stage HDI WiFi module PCB |
| Number of layers: | 6 layers |
| Material: | FR4 Tg170 |
| Structure: | 2+2+2 HDI PCB |
| Finished product thickness: | 0. 8mm |
| Copper thickness: | 1OZ |
| Color: | black/white |
| Surface treatment: | immersion gold + OSP |
| Minimum trace/space: | 3 million/3 million |
| Minimum hole: | laser hole 0. 1mm |
| Application: | WiFi module PCB |