This is a 6-layer HDI rigid-flex PCB with blind and buried vias. Made of the most common rigid insulation material FR4 and DuPont polyimide, it has good bending performance. In addition, its 0. 6mm thick rigid area gives the board good strength. All laminates are from authorized distributors that have been inspected by XPCB.
This rigid-flex circuit adopts ENIG surface treatment, which has the advantages of good surface flatness, good oxidation resistance, and suitable for active contacts.
Name: | 6-layer 1-stage HDI PCB |
Number of layers: | 1+4+1 |
Sheet: | FR4 TG150 |
Board thickness: |
1. 6mm Panel size 105*95mm/1 |
Outer layer copper thickness: | 35μm |
Inner layer copper thickness: | 30μm |
Minimum through hole: | 0. 20mm |
Minimum blind hole: | 0. 10mm |
Minimum BGA: | 0. 20mm |
Line width and line spacing: | 3/3mil |