PCB High Frequency Microwave Hybrid Board
  • PCB High Frequency Microwave Hybrid Board PCB High Frequency Microwave Hybrid Board

PCB High Frequency Microwave Hybrid Board

Viafull as a professional high quality PCB High Frequency Microwave Hybrid Board manufacturer, you can rest assured to buy PCB High Frequency Microwave Hybrid Board from our factory and we will offer you the best after-sale service and timely delivery.

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Product Description

Hybrid PCB is commonly used in microwave RF series products

Viafull as the professional manufacturer, we would like to provide you high quality PCB High Frequency Microwave Hybrid Board. And we will offer you the best after-sale service and timely delivery. With the rapid development of electronic communication technology, in order to achieve high-speed and high-fidelity signal transmission, more and more microwave radio frequency PCBs are used in communication equipment. The dielectric materials used in high-frequency hybrid circuit boards have excellent electrical properties and good chemical stability, which are mainly manifested in the following four aspects.

1. Hybrid PCB has the characteristics of low signal transmission loss, short transmission delay time, and low signal transmission distortion.

2. Excellent dielectric properties (mainly refers to low relative dielectric constant DK, low dielectric loss factor DF). In addition, the dielectric properties (DK, DF) remain stable under environmental changes such as frequency, humidity and temperature.

3. High-precision characteristic impedance control.

4. Hybrid PCB has excellent heat resistance (TG), processability and adaptability.

Microwave high-frequency hybrid PCBs are widely used in communication equipment such as wireless antennas, base station receiving antennas, power amplifiers, radar systems, navigation systems, etc.


Data Sheet

Name: PCB high-frequency microwave hybrid board
Number of layers: 6 layers
Board thickness: 1. 6±0. 14mm
Used board: Rogers4350B+FR4 Shengyi
Dielectric constant: 2. 2±0. 02
Dielectric loss factor: 0. 0009
Z minimum aperture: 0. 3mm
Surface treatment: ENIG
Z line width/spacing: 0. 2mm/0. 3mm
Process features: special materials, Rogers4350B+FR4 Shengyi mixed lamination


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