Communication High Frequency Mixing Board

Viafull is a professional China Communication High Frequency Mixing Board manufacturer and supplier, if you are looking for the Communication High Frequency Mixing Board, consult us now! The high-frequency hybrid splint includes a bottom plate, which is folded from bottom to top and placed on the top surface of the first inner line layer, the first outer line layer and the solder mask ink layer. Positioning line layer, second outer line layer, second solder mask ink layer on the bottom of the substrate, the substrate includes a high-frequency area and an auxiliary area, the auxiliary area is fixed last, and the high-frequency area should be located in a fixed position. The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. Provide mechanical support. The utility model discloses that the high-frequency area is independently set, and only the high-frequency area is made of high-frequency materials. Under the condition of meeting the high-frequency signal, the use of high-frequency board materials is minimized to reduce production costs.

Classification of high-frequency hybrid products

Number of layers: 6 layers

Used board: Ro4350B+FR4

Thickness: 1. 6mm

Size: 210mm*280mm

Surface treatment: gold plating

Minimum aperture: 0. 25mm

Application: communication

Features: high-frequency hybrid pressure

Data Sheet