Preamplifier, satellite antenna, GPS tracking device, SAN storage, AC drive, GSM signal booster, mobile broadband router, 220V inverter, memory module, car dashboard
Cutting/baking materials—> Inner layer drilling—> Inner layer pattern transfer—> Inner layer line detection—> Etching/stripping—> Etching detection—> Browning—> Semi-cured sheet preparation—> Lamination—> Cutting copper foil—> Positioning—> Fitting—> Target hole—> Drilling—> Glue removal—> Copper immersion—> Graphic transfer—> Line detection—> Copper plating and tin plating—> Film removal and etching—> Tin removal—> Etching detection—> Dielectric detection test—> Solder mask detection—> Text—> Baking tray—> Spray tin, immersion gold, immersion tin—> Shape—> V cut—> Finished product test—> Anti-oxidation—> Final inspection—> Finished product extraction—> Packaging
Product name: | 10-layer PCB circuit board |
Number of layers: | 10L |
Sheet: | FR4 Tg170 |
Board thickness: | 2. 4mm |
Panel size: | 120*95mm/1 |
Outer layer copper thickness: | 35μm |
Inner layer copper thickness: | 35μm |
Minimum through hole: | 0. 20mm |
Minimum BGA: | 0. 25mm |
Line width and line spacing: | 3/3. 2mil |
Surface treatment: | immersion gold 2U'' |