Small BGA Circuit Board

The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a pin packaging method for large components. The difference is that the "1-dimensional space" single-row pins listed around, such as gull-wing extension pins, flat extension pins or J-shaped pins retracted to the bottom of the abdomen, etc., are changed to a full array or partial array at the bottom of the abdomen, and solder balls distributed in a two-dimensional space area are used as a welding interconnection tool for chip packaging to the circuit board. It has the characteristics of small packaging area, increased functions, increased number of pins, high reliability, good electrical performance, and low comprehensive cost.

Data Sheet