Electroless nickel plating (ENIG or ENI/IAU), also known as immersion gold (AU), chemical Ni/AU, or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs) to avoid copper oxidation and improve touch and plated holes.
| Name: | Multilayer immersion gold PCB |
| Type: | Rigid PCB |
| Copper thickness: | 1/3OZ~6 OZ |
| Application: | Electronics |
| Packaging: | Vacuum packaging |
| Quality certification: | ISO9001, ISO14001, TS16949, RoHs |