1. For PCB boards that need to be frequently plugged and unplugged, the gold fingers generally need to be hard-plated to increase the wear resistance of the gold fingers.
2. The gold fingers need to be tilted backwards, generally 45°, other angles such as 20°, 30°, etc. If the design does not tilt backwards, there is a problem. The arrow in the figure below shows a 45° tilt angle:
3. The gold finger needs to make a whole welding window. The PIN does not need to open the steel mesh;
4. The minimum distance between Shenxi and Shenyin pads is 14 million. It is recommended that the pad be more than 1mm away from the finger position, including the via pad;
5. Do not apply copper on the surface of the gold finger.
Name: | Multi-layer gold finger motherboard control PCB |
Type: | Multi-layer circuit board |
Number of layers: | 6 layers |
Base material: | FR4, aluminum, high Tg FR4 |
Copper thickness: | 0. 5-1 ounce |
Board thickness: | 0. 4-4. 0mm |
Aperture: | 0. 15-0. 2mm |
Line width: | 0. 1-0. 3mm |
Line spacing: | 0. 1-0. 3mm |
Surface treatment: | immersion gold, tin spraying, gold finger |
Solder mask: | green |