Multi-layer Gold Finger Motherboard Control PCB
  • Multi-layer Gold Finger Motherboard Control PCB Multi-layer Gold Finger Motherboard Control PCB

Multi-layer Gold Finger Motherboard Control PCB

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Product Description

Detailed processing of PCB gold fingers:

1. For PCB boards that need to be frequently plugged and unplugged, the gold fingers generally need to be hard-plated to increase the wear resistance of the gold fingers.

2. The gold fingers need to be tilted backwards, generally 45°, other angles such as 20°, 30°, etc. If the design does not tilt backwards, there is a problem. The arrow in the figure below shows a 45° tilt angle:

3. The gold finger needs to make a whole welding window. The PIN does not need to open the steel mesh;

4. The minimum distance between Shenxi and Shenyin pads is 14 million. It is recommended that the pad be more than 1mm away from the finger position, including the via pad;

5. Do not apply copper on the surface of the gold finger.


Data Sheet

Name: Multi-layer gold finger motherboard control PCB
Type: Multi-layer circuit board
Number of layers: 6 layers
Base material: FR4, aluminum, high Tg FR4
Copper thickness: 0. 5-1 ounce
Board thickness: 0. 4-4. 0mm
Aperture: 0. 15-0. 2mm
Line width: 0. 1-0. 3mm
Line spacing: 0. 1-0. 3mm
Surface treatment: immersion gold, tin spraying, gold finger
Solder mask: green


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