What Are The Small BGA Circuit Boards?

In today's electronic manufacturing field where the requirements for miniaturization, high performance and low power consumption are increasing, Small BGA Circuit Board is becoming the mainstream choice in the industry. BGA, the full name of which is Ball Grid Array, is different from the traditional single-row pin packaging method. It cleverly distributes the solder connection points in the two-dimensional plane area at the bottom of the component. This packaging method not only greatly improves the pin density, but also optimizes the electrical performance and heat dissipation capacity, making it shine in high-end electronic equipment.

What Changes Can Small BGA Circuit Board Bring To The Product?

Using Small BGA Circuit Board means higher functional integration, smaller packaging area and more stable performance. Due to the use of high-precision solder ball connection, it has natural advantages in signal transmission and anti-interference, and is suitable for high-frequency and high-speed application environments with high requirements for performance stability. In addition, BGA packaging can effectively solve the welding reliability problems faced by traditional pin packaging, greatly reduce the risk of false soldering and poor contact, and further improve the long-term stability and service life of the whole product.

What Is Special About Small BGA Circuit Board In Terms Of Technical Specifications?

This Small BGA Circuit Board adopts a four-layer board structure design and uses FR4 TG170 high-temperature material to ensure good thermal stability under a variety of complex working conditions. The board thickness is controlled at 1.6mm, which meets the mainstream design requirements. The surface treatment method adopts ENIG (chemical nickel plating gold), and the gold layer thickness is 2 micro inches, which not only enhances the welding reliability, but also improves the anti-oxidation ability. The minimum line width/line spacing can reach 0.07/0.09mm, and the BGA pad diameter is accurate to 0.25mm, demonstrating our precise control ability in micron-level process processing.

Which Industries Need Small BGA Circuit Board The Most?

Small BGA Circuit Board is widely used in smartphones, laptops, wearable devices, automotive electronic systems, industrial controllers, communication modules, medical equipment, etc., which have extremely high requirements for volume, performance and reliability. With the development of technologies such as AI, 5G, and the Internet of Things, the demand for small and high-density circuit boards continues to rise, and BGA packaging is the key technology to meet this trend. Especially in space-constrained but function-intensive products, it is almost irreplaceable.

Why Choose Us?

We not only focus on the stability of materials and processes, but also work hard on quality control and technical services. The product uses Sunlight PSR-4000 green solder mask ink to ensure good insulation and visual recognition; at the same time, we provide professional customization services, which can adjust the pad size, board layer design and surface treatment method as needed to meet the differentiated needs of different terminal products. Our production process is strictly implemented in accordance with the ISO quality management system to ensure that each circuit board can meet international standards.  

Founded in 2009, Guang Dong Viafine PCB LIMITED is a professional printed circuit board (PCB) printed circuit board assembly (PCBA) integrated service high-tech enterprise, specializing in the R&D and production of high-precision multilayer boards and special boards.Learn more about what we offer by visiting our website at https://www.viafinegroup.com/. For questions or support, contact us at sales13@viafinegroup.com.